Future designs for these applications will require high performance and efficiency in cloud and networking infrastructure, mobile devices, and graphics processing units (GPUs). Alchip’s silicon-proven ...

mobile devices, and graphics processing units (GPUs). Alchip’s silicon-proven 3DIC design flow has optimized selected 3DIC designs along three critical dimensions: power delivery, die-to-die ...

17, 2021 -- To strengthen innovation of complex SoCs for compute-intensive applications such as high-performance computing, AI and 5G, Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC ...

3DIC Compiler provides packaging design solutions required by today's complex multi-die systems for applications like high-performance computing (HPC), automotive and mobile. "Applications such as AI ...

mobile, and GPU applications. With these advancements, Alchip aims to offer a cost-efficient solution to manage the complexities of next-generation 3DIC ASIC designs. In other trading ...

Future designs for these applications will require high performance and efficiency in cloud and networking infrastructure, mobile devices, and graphics processing units (GPUs). Alchip's silicon-proven ...

mobile devices, and graphics processing units (GPUs). Alchip's silicon-proven 3DIC design flow has optimized selected 3DIC designs along three critical dimensions: power delivery, die-to-die ...

Future designs for these applications will require high performance and efficiency in cloud and networking infrastructure, mobile devices, and graphics processing units (GPUs). Alchip’s silicon-proven ...