consists of multiple chips glued together using a complex chip on wafer on substrate (CoWoS) advanced packaging technology offered by Taiwan Semiconductor Manufacturing Co (TSMC), Nvidia's main ...

B AI model on its wafer-scale processor, delivering 57x faster speeds than GPU solutions and challenging Nvidia's AI chip ...

Chip testing and packaging services provider Powertech Technology Inc (力成科技) yesterday said it expects a significant pickup in the second quarter of this year on recovering demand from the DRAM ...

The SSD memory with the highest cell density comes from YMTC. The manufacturer is ahead of Samsung, SK Hynix and other ...

Gudeng Precision Industrial Co (家登精密), the sole extreme ultraviolet (EUV) pod supplier to Taiwan Semiconductor Manufacturing ...

Lam Research posted a second-quarter adjusted profit per share of 91 cents, beating analysts' estimate of 88 cents. The company posted revenue of $4.38 billion for the three months ended Dec.29, ...