Based on modular design the EVG540 provides a proven solution for later transition of wafer bonding processes from R&D stage to large-scale manufacturing on our fully integrated production bonding ...

stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and ...

Bond Pads,Bond Yields,Boxplots,Carrier Wafer,Cause-effect Relationship,Chain Structure,Chemical Reactions, Gerald Beyer received the M.Sc. degree in materials science from Thames Polytechnic, London, ...