Back‐end processing involves the major steps of back‐side metal contact, visual inspection, wafer thinning, dicing, and wafer packaging on tape. Automatic wafer tracking systems are implemented to ...

The dual-flow concept makes it possible to run each wafer process line independently. Maintenance can be performed while the system is running production, greatly reducing system downtime.

Taiwanese media outlet Economic Daily News reported that TSMC has completed limited risk production of around 5,000 wafers using its 2nm process at the Baoshan fab in Hsinchu Science Park. Why it ...

Abstract: During early fan‐out wafer‐level packaging (FO‐WLP), when Infineon was developing their embedded wafer‐level ball grid array technology, 200 mm physical vapor deposition (PVD) systems were ...

Ortel, the California-based supplier of optical communications components now owned by Photonics Foundries, says it has ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

One of the innovations involves the integration of the diffusion process, combining the doping of solar and the thermal oxidization of the wafers in a single step. Thermal oxidization of wafers is ...

But there is a catch. TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it was expected that world's largest contract maker ...

The Recharged Czochralski (RCz) crystal growth process, which enables crucible re-use without powering down between pulls, is increasingly used to produce ingots for both n-type and p-type wafers ...