A research team in Germany has proposed to use direct wire bonding to reduce silver consumption in heterojunction solar cells ...

Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package. THIS DEFINITION IS FOR ...

不同封装形式对材料的要求也不同，我们已在Wire Bond类封装基板产品大批量应用，主要应用于传感器、卡类、射频、摄像头、指纹识别、存储类等 ...

Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...