SEMI’s Ana Bernardo reports on key discussions at the recent MEMS & Imaging Sensors Summit 2024, including implications for ...

Researchers from Nokia Bell Labs developed a new type of optical memory called a programmable photonic latch that enables ...

A chiplet supermarket is still years off, but progress is being made on all fronts.

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

The growing internet of medical things (IoMT) has unique definitions and testing requirements.

LLMs for chip design; CIM accelerators; polaron crossover in tellurene; M3D FPGA w/BEOL config memories; ASIC AI chips for homomorphic encryption; ...

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

Steve Woo, distinguished inventor and fellow at Rambus, examines the benefits of a common substrate for communication, the ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

This enables the EUV lithography era of today, which is likely to continue for the foreseeable future. Initially, EUV became ...

Trump's tech stamp; Chiplet Summit announcements; AI diffusion export concerns; Cadence's security acquisition; chiplets; UMC ...

The ongoing electrification of everyday items has resulted in the proliferation of batteries, and spurred continued development for automotive and grid use. Lithium-ion batteries still dominate the ...