Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key ...

Wafer bonding is the one key bulk micromachining technology. There are roughly three types of wafer bonding: direct wafer bonding, anodic bonding, and intermediate‐layer bonding. The SCREAM process is ...