UMC Q4'24 results disappoint with margin pressures. Recovery expected in 2025, but pricing remains a risk. Explore more ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Pure play semiconductor foundry GlobalFoundries (GF) said it will create a new center for advanced packaging and testing of U.S.-made essential chips at its New York manufacturing facility.

Shares of United Microelectronics (UMC) fell 4% after Q4 results missed estimates and Citi double downgraded the stock to ...

OphirSP402S Large Format Beam Profiler Camera high-resolution laser beam profiler camera with large 1.1” sensor format, ...

Engineers from Eindhoven University of Technology are claiming to have set a new benchmark for the performance of InP ...

GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA.

GlobalFoundries announces plans to create a new centre for advanced packaging and testing of US-made essential chips.

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an ...

Onto Innovation secures orders for 3Di technology on Dragonfly G3. The launch of Iris G2 expands the metrology suite for the ...