Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Bernardette Kunert, scientific director at imec, commented, “Over the past years, imec has pioneered nano-ridge engineering, a technique that builds on SAG and ART to grow low-defectivity III-V ...

GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA.

Pure play semiconductor foundry GlobalFoundries (GF) said it will create a new center for advanced packaging and testing of U.S.-made essential chips at its New York manufacturing facility.

Imec has  demonstrated electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers ...

Onto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di™ technology on the Dragonfly® G3 system for bump process ...

GlobalFoundries announces plans to create a new centre for advanced packaging and testing of US-made essential chips.

Imec, a research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically driven ...