TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

Benchmark is the world's leading independent supplier of test reticles for lithography systems. For 3 decades, our products have been used by wafer fabs and fab equipment and materials suppliers to ...

by using wafer-level packaging. A heterogeneous SoC entails partitioning the SoC at the IO or core level, using a modular approach with different building blocks. This offers several advantages, ...