UMC Q4'24 results disappoint with margin pressures. Recovery expected in 2025, but pricing remains a risk. Explore more ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Pure play semiconductor foundry GlobalFoundries (GF) said it will create a new center for advanced packaging and testing of U.S.-made essential chips at its New York manufacturing facility.

United Microelectronics Corporation ( NYSE: UMC) Q4 2024 Earnings Conference Call January 21, 2025 4:00 AM ET Michael Lin - Head of Investor Relations Jason Wang - President Chitung Liu - Chief ...

Ophir SP402S Large Format Beam Profiler Camera high-resolution laser beam profiler camera with large 1.1” sensor format, ...

Engineers from Eindhoven University of Technology are claiming to have set a new benchmark for the performance of InP ...

GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA.

GlobalFoundries announces plans to create a new centre for advanced packaging and testing of US-made essential chips.

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an ...

Imec, a research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically driven ...