Two widely used configurations exist for PoP:
• Pure memory stacking: two or more memory only packages are stacked on each other
• Mixed logic-memory stacking: logic (CPU) pack… 展开

The package on a package technique tries to combine the benefits of traditional packaging with the benefits of die-stacking techniques, while avoiding their drawbacks.
Traditional packaging places each die in its own package, a … 展开

• JEDEC JC-11 committee deals with package outline drawing standards related to the bottom PoP package. See documents MO-266A and JEDEC publication 95, Design Guide 4.22.
• JEDEC JC-63 committe… 展开

Package on a package is also known by other names:
• PoP: refers to the combined top and bottom packages
• PoPt: refers to the top package… 展开